Methods for removal of organic materials

Details Methods for removal of organic materials Methods for removal of organic materials

2007-06-05

2007-06-05

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C257SE21002

Reexamination Certificate

active

10734995

ABSTRACT:
The invention includes methods of forming capacitor structures and removing organic material. An organic material, such as a photoresist, is disposed on a substrate. The organic material is contacted with a chemical mechanical polishing pad and a polishing fluid to remove the organic material from the substrate. The polishing fluid can be essentially free of particles, and can be water.

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