Semiconductor device with recessed post electrode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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Details

C257S737000, C257SE21058, C257SE23021

Reexamination Certificate

active

10995411

ABSTRACT:
A semiconductor device includes a semiconductor chip which has a top surface, a conductive member which includes a first portion which is located on the electrode pad and a second portion which is extended from the first portion, and a sealing resin which seals the top surface of the semiconductor chip and the conductive member. A top surface of the second portion is exposed from the sealing resin and a part of the top surface of the second portion is concaved from a surface of the sealing resin. An external electrode is formed on the top surface of the second portion.

REFERENCES:
patent: 6337445 (2002-01-01), Abbott et al.
patent: 6404051 (2002-06-01), Ezawa et al.
patent: 6642626 (2003-11-01), Park
patent: 6734568 (2004-05-01), Matsuo et al.
patent: 6793116 (2004-09-01), Harada
patent: 2003/0052409 (2003-03-01), Matsuo et al.
patent: 2003/0052414 (2003-03-01), Cowens et al.
patent: 2004/0201097 (2004-10-01), Ohsumi
patent: 2004/0238955 (2004-12-01), Homma et al.
patent: 2005/0017356 (2005-01-01), Ohsumi
patent: 2005/0073049 (2005-04-01), Tsubosaki
patent: 2005/0093149 (2005-05-01), Nakatani
patent: 2005/0098891 (2005-05-01), Wakabayashi et al.
patent: 2000-228455 (2000-08-01), None
patent: 3217046 (2001-08-01), None
patent: 2002-170427 (2002-06-01), None

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