Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2007-06-05
2007-06-05
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S737000, C257SE21058, C257SE23021
Reexamination Certificate
active
10995411
ABSTRACT:
A semiconductor device includes a semiconductor chip which has a top surface, a conductive member which includes a first portion which is located on the electrode pad and a second portion which is extended from the first portion, and a sealing resin which seals the top surface of the semiconductor chip and the conductive member. A top surface of the second portion is exposed from the sealing resin and a part of the top surface of the second portion is concaved from a surface of the sealing resin. An external electrode is formed on the top surface of the second portion.
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Fenty Jesse A.
Oki Electric Industry Co. Ltd.
Parker Kenneth
Volentine & Whitt P.L.L.C.
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