Method and apparatus for mounting and removing an electronic...

Details Method and apparatus for mounting and removing an electronic... Method and apparatus for mounting and removing an electronic...

2007-11-27

2007-11-27

Stoner, Kiley (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S191000, C228S233200, C228S234100, C228S264000

Reexamination Certificate

active

11288279

ABSTRACT:
A method and an apparatus are provided for mounting and removing electronic components using solder bumps while constraining thermal stresses to a substrate. The method and apparatus for mounting and removing an electronic component (bear chip32) to be soldered onto the substrate with solder bumps114is configured to move the electronic component to detect contact of the solder bumps with the substrate or contact of a tool (chuck unit38) with the electronic component, to define the contact as an original point for raising a heating temperature of the electronic component and the substrate from the heating temperature to a maximum heating temperature HTm as well as move the electronic component in conformity with the temperature rising, and to move the electronic component from a position where the maximum heating temperature is achieved to a mounting height of the substrate.

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