Method for fabricating a gyroscope

Details Method for fabricating a gyroscope Method for fabricating a gyroscope

2007-06-05

2007-06-05

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C029S602100, C073S503300, C073S504020, C074S00500R, C074S005400, C216S062000, C216S066000, C216S067000, C451S005000, C451S041000

Reexamination Certificate

active

11002241

ABSTRACT:
Method for fabricating a gyroscope including: fabricating a SMS wafer where a first wafer, a metal film, and a second wafer are sequentially stacked; forming a cantilever or a bridge shaped-structure on the relevant portion of the first wafer through the photolithography process; attaching to the surface of the first wafer, a first cap made of glass and having a predetermined space for sealing the movable structure in a vacuum state; separating and removing the metal film and the second wafer from the first wafer; and attaching to the backside of the first wafer, the second cap which is structurally and materially symmetric to the first cap. The SMS wafer is fabricated by depositing the metal film on the second wafer and bonding the first wafer on the metal film using metal paste or material of polymer series. With lower material costs, improvements in performance and characteristics can be achieved.

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“A silicon wafer dissolved vibrating gyroscope”; Yao Yahong; Gao Zhongyu; Zhang Rong; Dong Yuqian; Chen Zhiyong; Instrumentation and Measurement Technology Conference, 1998. IMTC/98. Conference Proceedings. IEEE vol. 2; May 18-21, 1998; pp.: 1133-1136.

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