Polyepoxy compounds having an amide linkage

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C525S423000, C525S425000, C525S429000, C525S432000

Reexamination Certificate

active

10492224

ABSTRACT:
The present invention provides compounds that have an amide linkage and at least two epoxy groups. The compounds are preferably aliphatic.

REFERENCES:
patent: 3042692 (1962-07-01), Findley et al.
patent: 3235568 (1966-02-01), Findley et al.
patent: 3873457 (1975-03-01), Magne et al.
patent: 3931058 (1976-01-01), Batzer et al.
patent: 4199460 (1980-04-01), Sumrell et al.
patent: 4520175 (1985-05-01), Arai et al.
patent: 6153771 (2000-11-01), Lane et al.
patent: 2147899 (1974-01-01), None
patent: 2437318 (1976-02-01), None
patent: 4218837 (1993-12-01), None
patent: 0 094 436 (1983-11-01), None
patent: 0 155 810 (1985-09-01), None
patent: 0 747 371 (1996-12-01), None
patent: 0 919 868 (1999-06-01), None
patent: 1119030 (1970-03-01), None
patent: 62-85244 (1987-04-01), None
patent: 5-59031 (1993-03-01), None
patent: 9-50099 (1997-02-01), None
patent: 9-222707 (1997-08-01), None
patent: 1413113 (1988-07-01), None
patent: WO 02/055011 (2002-07-01), None
Hackh's Chemical Dictionary, Fourth Edition, McGraw-Hill Book Company, New York, New York, 1969, p. 27.
XP-002225696; 6001 Chemical Abstracts, Columbus, OH, vol. 64 Apr. 11, 1966, No. 8, pp. 11356.
XP-002225697; 6001 Chemical Abstracts, Columbus OH, vol. 57 Aug. 20, 1982, No. 4.
XP-002225694; 6001 Chemical Abstracts, Columbus, OH, vol. 90 May 28, 1979, No. 22.
XP-002225693; 6001 Chemical Abstracts, Columbus, OH, vol. 12 Jun. 15, 1998, No. 24.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Polyepoxy compounds having an amide linkage does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyepoxy compounds having an amide linkage, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyepoxy compounds having an amide linkage will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3808890

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.