Stacked multiple connection module

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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C361S736000, C361S790000

Reexamination Certificate

active

11096992

ABSTRACT:
A stacked multiple connection module that provides multiple times the input/output (I/O) signal capacity of a single connection module. In one embodiment, a stacked dual connection module includes first and second circuit boards with respective edge connectors maintained at a parallel offset and configured to couple to a mating two slotted stacked edge connector. A connection means is provided to couple signals between the first and second circuit boards, such that components mounted on the first and/or second circuit board are enabled to access I/O signals via both of the edge connectors, thus doubling I/O signal capacity. In one embodiment, the stacked dual connection module comprises an Advanced Mezzanine Card (AdvancedMC) module having edge connectors configured to mate with an AdvancedMC connector.

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