Circuit substrate manufacturing method

Details Circuit substrate manufacturing method Circuit substrate manufacturing method

2007-05-29

2007-05-29

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S847000, C029S831000, C156S248000, C174S259000

Reexamination Certificate

active

11034985

ABSTRACT:
A circuit substrate manufacturing method including the steps of preparing a substrate on which a metallic foil is formed in a releasable state, forming a build-up wiring on the metallic foil, obtaining a circuit member having a structure that the build-up wiring is formed on the metallic foil by releasing the metallic foil from the substrate, and exposing a lowest wiring layer of the build-up wiring by removing the metallic foil of the circuit member.

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patent: 6772515 (2004-08-01), Suwa et al.
patent: 2002/0001937 (2002-01-01), Kikuchi et al.
patent: 2003/0080409 (2003-05-01), Nakamura et al.
patent: 2000-323613 (2000-11-01), None
patent: 2002-83893 (2002-03-01), None
patent: 2003-142617 (2003-05-01), None

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