Integrated circuit package with improved electro-static...

Details Integrated circuit package with improved electro-static... Integrated circuit package with improved electro-static...

2007-06-19

2007-06-19

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S659000, C257S691000, C257S692000, C257S676000

Reexamination Certificate

active

10837014

ABSTRACT:
An integrated circuit (IC) package having a spark gap feature for electro static discharge protection is disclosed. The IC package includes an integrated circuit package substrate. An integrated circuit die is placed on the package substrate. Also on the package substrate are a first lead trace connected to the integrated circuit die and a second lead trace adjacent the first lead trace. The second lead trace is also connected to the integrated circuit die. The second lead trace has a spark gap feature allowing at least a portion of electro static spike on the second lead trace to jump to the first lead trace. The spark gap feature can be implemented in various ways including a protrusion from the second lead trace to the first lead trace, the protrusion having a sharp vertex proximal to the first lead trace.

REFERENCES:
patent: 5216278 (1993-06-01), Lin et al.
patent: 5424896 (1995-06-01), Pasch et al.
patent: 5552951 (1996-09-01), Pasch et al.

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