Thin film deposition apparatus

Coating apparatus – Gas or vapor deposition – With treating means

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Details

118723ME, 118723ER, C23C 1648, C23C 1650

Patent

active

055229360

ABSTRACT:
A thin film deposition apparatus forms a thin film onto substrates by use of a plasma gas and a material gas. In this apparatus, generation of particles in a deposition chamber can be reduced and hence a high quality thin film with fewer surface defects can be formed. The apparatus comprises a bell jar, a power-supply unit for supplying electric power to the bell jar, a deposition chamber, a vacuum pumping unit for evacuating the deposition chamber, a first gas introduction unit for introducing a gas used for generating plasma, and a second gas introduction unit for introducing a material gas used for forming the thin film, and further a blocking member for preventing either or both of the material gas and the plasma from entering a space between a gas supply end-portion of the second introduction unit and an interior surface of the deposition chamber. The blocking member is shaped to have relatively large curvature.

REFERENCES:
patent: 4401054 (1983-08-01), Matsuo

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