Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-11-27
2007-11-27
Chérvinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C174S015100, C174S016300, C257S714000
Reexamination Certificate
active
11083267
ABSTRACT:
A heat-receiving plate of a pump has a heat-receiving surface and a guide. The heat-receiving surface is thermally connected to a heat-generating body. The guide is provided on the heat-receiving surface. The guide is opposed to the heat-generating body.
REFERENCES:
patent: 5168926 (1992-12-01), Watson et al.
patent: 5268817 (1993-12-01), Miyagawa et al.
patent: 5731952 (1998-03-01), Ohgami et al.
patent: 5770478 (1998-06-01), Iruvanti et al.
patent: 5903536 (1999-05-01), Lee et al.
patent: 6005767 (1999-12-01), Ku et al.
patent: 6141214 (2000-10-01), Ahn
patent: 6166907 (2000-12-01), Chien
patent: 6175497 (2001-01-01), Tseng et al.
patent: 6196850 (2001-03-01), Dietz et al.
patent: 6231371 (2001-05-01), Helot
patent: 6282082 (2001-08-01), Armitage et al.
patent: 6296048 (2001-10-01), Sauer
patent: 6313990 (2001-11-01), Cheon
patent: 6333847 (2001-12-01), Katsui et al.
patent: 6377452 (2002-04-01), Sasaki et al.
patent: 6396687 (2002-05-01), Sun et al.
patent: 6418017 (2002-07-01), Patel et al.
patent: 6430038 (2002-08-01), Helot et al.
patent: 6437973 (2002-08-01), Helot et al.
patent: 6464195 (2002-10-01), Hildebrandt
patent: 6477871 (2002-11-01), Shaw et al.
patent: 6483445 (2002-11-01), England
patent: 6519143 (2003-02-01), Goko
patent: 6519147 (2003-02-01), Nakagawa et al.
patent: 6519148 (2003-02-01), Nakagawa et al.
patent: 6570764 (2003-05-01), Bhatia et al.
patent: 6594149 (2003-07-01), Yamada et al.
patent: 6611425 (2003-08-01), Ohashi et al.
patent: 6625024 (2003-09-01), Mermet-Guyennet
patent: 6654234 (2003-11-01), Landry et al.
patent: 6656770 (2003-12-01), Atwood et al.
patent: 6702007 (2004-03-01), Pan et al.
patent: 6717798 (2004-04-01), Bell et al.
patent: 6728102 (2004-04-01), Ishikawa et al.
patent: 6752204 (2004-06-01), Dishongh et al.
patent: 6755626 (2004-06-01), Komatsu et al.
patent: 6757170 (2004-06-01), Lee et al.
patent: 6774870 (2004-08-01), Mead, Jr. et al.
patent: 6809927 (2004-10-01), Ohashi et al.
patent: 6831836 (2004-12-01), Bhatia et al.
patent: 6839234 (2005-01-01), Niwatsukino et al.
patent: 6856506 (2005-02-01), Doherty et al.
patent: 6870736 (2005-03-01), Lee et al.
patent: 6873521 (2005-03-01), Landry et al.
patent: 6983789 (2006-01-01), Jenkins et al.
patent: 7006353 (2006-02-01), Matteson
patent: 7149087 (2006-12-01), Wilson et al.
patent: 2002/0018337 (2002-02-01), Nakamura
patent: 2002/0053421 (2002-05-01), Hisano et al.
patent: 2002/0141159 (2002-10-01), Bloemen
patent: 2002/0192087 (2002-12-01), Hsieh
patent: 2003/0039097 (2003-02-01), Igarashi
patent: 2003/0142474 (2003-07-01), Karidis et al.
patent: 2004/0057197 (2004-03-01), Hill et al.
patent: 2005/0007739 (2005-01-01), Gata
patent: 2005/0052833 (2005-03-01), Tanaka et al.
patent: 2005/0068732 (2005-03-01), Tsuji
patent: 2005/0164624 (2005-07-01), Hisamatsu
patent: 1299993 (2007-01-01), None
patent: 0834795 (1998-04-01), None
patent: 07-049725 (1995-02-01), None
patent: 07-142886 (1995-06-01), None
patent: 08/046097 (1996-02-01), None
patent: 10-004161 (1998-01-01), None
patent: 10-055227 (1998-02-01), None
patent: 10-261884 (1998-09-01), None
patent: 10-303582 (1998-11-01), None
patent: 11-039058 (1999-02-01), None
patent: 11-166500 (1999-06-01), None
patent: 2000-049478 (2000-02-01), None
patent: 2001-057490 (2001-02-01), None
patent: 2001-230356 (2001-08-01), None
patent: 2001-251079 (2001-09-01), None
patent: 2001-325164 (2001-11-01), None
patent: 2002-099356 (2002-04-01), None
patent: 2002151638 (2002-05-01), None
patent: 2002-344186 (2002-11-01), None
patent: 2002-353670 (2002-12-01), None
patent: 2003-044169 (2003-02-01), None
patent: 2003-068317 (2003-03-01), None
patent: 2003-101272 (2003-04-01), None
patent: 2003-172286 (2003-06-01), None
patent: 2003-216278 (2003-07-01), None
patent: 3431024 (2003-07-01), None
patent: 2003-233441 (2003-08-01), None
patent: 3452059 (2003-09-01), None
patent: 2003-343492 (2003-12-01), None
patent: 2004-047921 (2004-02-01), None
English translation of Chinese Office Action dated Nov. 24, 2006.
Hata Yukihiko
Tomioka Kentaro
Blakley Sokoloff Taylor & Zafman LLP
Chervinsky Boris
Kabushiki Kaisha Toshiba
LandOfFree
Heat-receiving apparatus and electronic equipment does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat-receiving apparatus and electronic equipment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-receiving apparatus and electronic equipment will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3804261