Heat dissipation device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S699000, C361S702000, C361S703000, C165S080400, C165S080500

Reexamination Certificate

active

11164860

ABSTRACT:
A heat dissipation device for dissipating heat from an electronic device comprises a base, a heat dissipation member provided with two heat-dissipating plate groups intercrossed with each other and defining a plurality of air passages. At least a heat pipe connects the base with the heat dissipation member to transfer heat from the base to the heat dissipation member. A first heat sink and a second heat sink respectively contact with lateral sides of the heat dissipation member. The heat pipe is partly sandwiched between the heat dissipation member and the first and second heat sinks.

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patent: 5535816 (1996-07-01), Ishida
patent: 6137682 (2000-10-01), Ishimine et al.
patent: 6478082 (2002-11-01), Li
patent: 6917522 (2005-07-01), Erturk et al.
patent: 6945319 (2005-09-01), Li et al.
patent: 7124806 (2006-10-01), Wang et al.
patent: 2001/0001981 (2001-05-01), Ueda et al.
patent: 2004/0226697 (2004-11-01), Liu
patent: 2005/0133199 (2005-06-01), Lo
patent: 2006/0144572 (2006-07-01), Yu et al.
patent: M243912 (2004-09-01), None
patent: M261012 (2005-04-01), None

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