Modular semiconductor package testing contactor system

Details Modular semiconductor package testing contactor system Modular semiconductor package testing contactor system

2007-03-13

2007-03-13

Le, Thanh-Tam (Department: 2839)

Electrical connectors

With coupling movement-actuating means or retaining means in...

For dual inline package

C324S754090

Reexamination Certificate

active

11177673

ABSTRACT:
An interconnect mechanism for providing electrical interconnection between a device under test and a tester includes a base having a first side and a second side. The base defines a plurality of apertures extending from the first side to the second side. The first side of the base is configured to receive the device under test. The interconnect mechanism also includes a plurality of alignment mechanisms configured to be detachably coupled to the first side of the base. The plurality of alignment mechanisms define an area of the first side of the base to receive the device under test when the plurality of alignment mechanisms are coupled to the first side of the base. Each of the plurality of alignment mechanisms includes an adjustment mechanism for adjusting the area of the first side of the base defined by the plurality of alignment mechanisms.

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International Search Report for PCT International Application PCT/US2005/024492 mailed Nov. 17, 2005.

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