Package substrate manufactured using electrolytic leadless...

Details Package substrate manufactured using electrolytic leadless... Package substrate manufactured using electrolytic leadless...

2007-04-24

2007-04-24

Ha, Nathan W. (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C257S700000

Reexamination Certificate

active

11003737

ABSTRACT:
A method of manufacturing a package substrate includes forming a first copper plated layer on a base substrate having through holes and inner surfaces of the through hole, coating a first resist over the first copper plated layer, partially removing the first resist, forming a second copper plated layer on the first copper plated layer, stripping the first resist, coating a second resist over the resultant structure, and removing the second resist from regions where wire bonding pads and solder ball pads are to be formed, removing exposed portions of the first copper plated layer, forming the wire bonding pads and the solder ball pads, removing the second resist, removing exposed portions of the first copper plated layer, and coating a solder resist over all surfaces of the resultant structure, and removing portions of the solder resist respectively covering the wire bonding pads and the solder ball pads.

REFERENCES:
patent: 6208525 (2001-03-01), Imasu et al.
patent: 6407341 (2002-06-01), Anstrom et al.
patent: 6649506 (2003-11-01), Hsu
patent: 6762921 (2004-07-01), Asai et al.
patent: 2003/0011070 (2003-01-01), Iijima et al.
patent: 2004/0048414 (2004-03-01), Heinz et al.
patent: 2004/0099939 (2004-05-01), Alcoe et al.
patent: 2004/0154166 (2004-08-01), Lee et al.
patent: 2004/0201095 (2004-10-01), Palmer et al.
patent: 2005/0067713 (2005-03-01), Mutta et al.
patent: 2005/0218503 (2005-10-01), Abe et al.
patent: 2006/0023439 (2006-02-01), Fraley et al.

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