Solid-state imager chip mounting

Details Solid-state imager chip mounting Solid-state imager chip mounting

1984-09-26

1986-11-11

Groody, James J.

Facsimile and static presentation processing

Static presentation processing

Attribute control

358 55, 358 41, 358 51, 357 24, H04N 909, H04N 904

Patent

active

046225803

ABSTRACT:
Conventionally, solid-state imager chips are packaged in ceramic IC packages. In accordance with the invention, unpackaged imager chips are bonded to a light transmissive carrier having an area substantially larger than the area of the imager chip. The light transmissive carrier both firmly supports the imager chip and includes a metallization pattern which contacts the imager chip and provides for its electrical connections to external drive and signal processing circuitry. In a preferred embodiment, the photosensitive side of a thinned-substrate solid-state imager chip is directly bonded to the exit port of a prism. The prism exit port has the metallization pattern formed thereon and includes edge connectors at its periphery for connecting to the external circuitry.

REFERENCES:
patent: 4044374 (1977-08-01), Roberts et al.
patent: 4166280 (1979-08-01), Poole
patent: 4266334 (1981-05-01), Edwards
patent: 4268119 (1981-05-01), Hartmann
patent: 4323918 (1982-04-01), Bendell
patent: 4418284 (1983-11-01), Ogawa et al.

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