Semiconductor device and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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Details

C257S761000, C257S773000, C257S774000, C257S775000, C257S759000, C257S760000

Reexamination Certificate

active

10816955

ABSTRACT:
The semiconductor device comprises a lower interconnection part12which is formed on a silicon substrate10and includes an inter-layer insulation film36formed of a low-k film32and a hydrophilic insulation film34formed on the low-k film32,and an interconnection layer44a, 44bburied in interconnection trenches38a, 38bformed in the inter-layer insulation film36and having an interconnection pitch which is a first pitch; and an intermediate interconnection part14which is formed on the lower interconnection part12and includes an inter-layer insulation film142formed of low-k films136, 140,an interconnection layer152a, 152bburied in interconnection trenches146a, 146bformed in the inter-layer insulation film142and having an interconnection pitch which is a second pitch larger than the first pitch, and an SiC film154formed directly on the low-k film140and the interconnection layer152a, 152b.

REFERENCES:
patent: 5739579 (1998-04-01), Chiang et al.
patent: 6373136 (2002-04-01), Otsuka et al.
patent: 6573604 (2003-06-01), Kajita
patent: 6670714 (2003-12-01), Miyamoto et al.
patent: 6680540 (2004-01-01), Nakano et al.
patent: 2004/0104481 (2004-06-01), Ong
patent: 2001-298084 (2001-10-01), None

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