Semiconductor device

Details Semiconductor device Semiconductor device

2007-03-06

2007-03-06

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S723000

Reexamination Certificate

active

10981676

ABSTRACT:
The present invention provides a technique which, without causing two problems, i.e., (1) increased number of power supply/grounding pins and (2) increased power feed line inductance, prevents the noise causing a problem in a control circuit, from becoming routed around and induced into an output buffer. More specifically, the above can be realized by using either of two methods: (A) providing an on-chip bypass capacitor for the control circuit and isolating a power feed route of the control circuit from that of the output buffer in an AC-like manner, or (B) designing electrical parameters (inserting resistors) such that the oscillation mode of any electrical parameter noise induced into the power feed routes will change to overdamping.

REFERENCES:
patent: 6833626 (2004-12-01), Kajiwara et al.
patent: 6914259 (2005-07-01), Sakiyama et al.
patent: 5-29531 (1993-02-01), None
patent: 6-140215 (1994-05-01), None

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