Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-09-11
2007-09-11
Chérvinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C361S703000, C361S704000, C361S709000, C361S710000, C257S706000, C257S707000, C257S715000, C257S722000, C174S015200, C174S015300, C165S080300, C165S104190, C165S104210, C165S104260, C165S104330
Reexamination Certificate
active
11306700
ABSTRACT:
A heat dissipation device includes a heat dissipation body and a heat conducting body thermally combined with the heat dissipation device. The heat dissipation body includes a central portion defining a through hole therein and a plurality of fin extending from a periphery of the central portion. Each of the fins branches a plurality of portions at an end thereof. The heat conducting body includes a column thermally fitted in the through hole of the central portion of the heat dissipation body. A cavity is defined between the column and the central portion of the heat dissipation body. The cavity contains a phase-changeable medium therein, which becomes vapor once the column absorbs heat from a heat-generating electronic device.
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Chen Chun-Chi
Wu Zhan
Zhou Shi-Wen
Chervinsky Boris
Foxconn Technology Co., Ltd.
Fu Zhun Prexision Industry (Shan Zhen) Co., Ltd.
Smith Courtney
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