Polishing apparatus

Details Polishing apparatus Polishing apparatus

2007-09-11

2007-09-11

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S010000, C451S011000, C451S288000, C451S910000

Reexamination Certificate

active

11423553

ABSTRACT:
Apparatus for polishing are provided. An apparatus comprises a fluid controller, a polishing apparatus and a fluid interface membrane. The fluid controller is fluidly coupled to the polishing apparatus by way of at least one conduit. The fluid interface membrane is disposed within at least one of the fluid controller, the conduit and the polishing apparatus to separate a first fluid and a second fluid and to transfer pressure from the first fluid to the second fluid.

REFERENCES:
patent: 5688364 (1997-11-01), Sato
patent: 6196900 (2001-03-01), Zhang et al.
patent: 6561868 (2003-05-01), Edwards et al.
patent: 2002/0086624 (2002-07-01), Zuniga et al.
patent: 2002/0151260 (2002-10-01), Crevasse et al.
patent: 2003/0073391 (2003-04-01), Janzen
patent: 2004/0033769 (2004-02-01), Zuniga et al.
patent: 2005/0239371 (2005-10-01), Togawa et al.

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