Method of manufacturing a semiconductor package using a lead...

Details Method of manufacturing a semiconductor package using a lead... Method of manufacturing a semiconductor package using a lead...

2007-03-27

2007-03-27

Pizarro, Marcos D. (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S123000, C257SE21506

Reexamination Certificate

active

10811999

ABSTRACT:
A lead frame comprises a stage for mounting a semiconductor chip thereon, a plurality of leads arranged in the periphery of the stage, and a plurality of lead interconnection members (e.g., dam bars) for interconnecting the leads, wherein a plurality of through holes are formed to penetrate through the lead frame in a thickness direction with respect to the leads or the lead interconnection members so as to allow a plurality of cutting lines to pass therethrough, whereby the leads are subjected to cutting and are made electrically independent of each other. A semiconductor package of a QFN type is produced by enclosing the lead frame within a molded resin, from which the leads are partially exposed to the exterior and are subjected to plating and are then subjected to cutting at the cutting lines.

REFERENCES:
patent: 5327008 (1994-07-01), Djennas et al.
patent: 6208023 (2001-03-01), Nakayama et al.
patent: 6909166 (2005-06-01), Frezza et al.
patent: 2-302068 (1990-12-01), None
patent: 4-27148 (1992-01-01), None
patent: 4-103154 (1992-04-01), None
patent: 04-134852 (1992-05-01), None
patent: 4-171855 (1992-06-01), None
patent: 5-309116 (1993-11-01), None
patent: 6-334090 (1994-12-01), None
patent: 07-030043 (1995-01-01), None
patent: 8-125088 (1996-05-01), None
patent: 10-303358 (1998-11-01), None
patent: 11-008261 (1999-01-01), None
patent: 11-354705 (1999-12-01), None
patent: 2002-164497 (2002-06-01), None
patent: 2002-246528 (2002-08-01), None
patent: 2002-359336 (2002-12-01), None
Harper; Electronic Packaging and Interconnection Handbook; 1991; McGraw-Hill, Inc.; New York; pp. 618.
Korean Office Action dated Dec. 21, 2005 (and English translation of same).

Affiliated with

Also associated with

Rating

Method of manufacturing a semiconductor package using a lead... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a semiconductor package using a lead..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a semiconductor package using a lead... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3788123