Planar plating apparatus

Details Planar plating apparatus Planar plating apparatus

2007-04-10

2007-04-10

Wilkins, III, Harry D. (Department: 1742)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S242000, C204S279000

Reexamination Certificate

active

10758752

ABSTRACT:
An apparatus for performing an electrochemical process on a surface of a workpiece comprises a platen assembly comprising a support platen, an electrolyte distribution plate, and a first conductive layer intermediate the support platen and distribution plate and configured to be coupled to at least a first potential. A carrier is configured to carry the workpiece and position the workpiece proximate the electrolyte distribution plate. A reservoir delivers an electrolyte to the electrolyte distribution plate. At least one contact separate from the platen assembly engages a peripheral region of the workpiece for coupling the workpiece to a second potential.

REFERENCES:
patent: 5178546 (1993-01-01), Dickerson
patent: 2001/0035354 (2001-11-01), Ashjaee et al.
patent: 2002/0053516 (2002-05-01), Basol et al.
patent: 2002/0079230 (2002-06-01), Basol et al.
patent: 2002/0121445 (2002-09-01), Basol et al.
patent: 2002/0134748 (2002-09-01), Basol et al.
patent: 2003/0089598 (2003-05-01), Basol et al.

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