Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-09-25
2007-09-25
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S593000, C029S830000, C029S841000, C156S249000, C156S289000, C438S118000, C438S119000
Reexamination Certificate
active
10210811
ABSTRACT:
A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first surface of the first microelectronic element. A second microelectronic element having electrically conductive parts is abutted against the releasable adhesive so that the second microelectronic element is releasably assembled to the first microelectronic element and the electrically conductive parts of the first and second microelectronic elements are connected to one another. The releasably assembled package is tested to determine whether the package has been properly assembled. A curable liquid is then introduced between the first and second microelectronic elements of a properly assembled package and the curable liquid is cured to permanently assemble the first and second microelectronic elements together.
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Lu et al., Evaluation of Die-Attach Adhesives by Curvature Measurements, IEEE Journal, InterSociety Conference on Thermal Phenomena, pp. 155-158, Feb. 8, 1992.
Lerner David Littenberg Krumholz & Mentlik LLP
Tessera Inc.
Tugbang A. Dexter
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