Method of making a semiconductor chip assembly with...

Details Method of making a semiconductor chip assembly with... Method of making a semiconductor chip assembly with...

2007-03-20

2007-03-20

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S113000

Reexamination Certificate

active

10403736

ABSTRACT:
A method of making a semiconductor chip assembly includes providing a semiconductor chip, a metal base, an insulative base and a routing line, wherein the chip includes a conductive pad, the metal base is disposed on a side of the insulative base that faces away from the chip, and the routing line is disposed on a side of the insulative base that faces towards the chip, then etching the metal base, forming an interconnect in a via, and forming a connection joint in an opening, wherein the via extends through the insulative base, the opening extends through the insulative base, the interconnect extends through the insulative base and is electrically connected to the routing line, and the connection joint electrically connects the routing line and the pad. Preferably, the opening extends through an insulative adhesive that attaches the routing line to the chip.

REFERENCES:
patent: 5347162 (1994-09-01), Pasch
patent: 6519161 (2003-02-01), Green

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