Stressed metal contact with enhanced lateral compliance

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

Reexamination Certificate

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Reexamination Certificate

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10737272

ABSTRACT:
An electrical interconnect structure that includes a spring portion that extends out of a plane. The electrical interconnect including curved regions to improve the lateral compliance of the interconnect. The curved region may be incorporated into a release region of the spring. The release region may include either or both an uplifted region and a planar region. The curves in the release region are arranged to improve the spring contact with a mating surface and also improve lateral compliance compared to prior art spring designs.

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Lunyu Ma, Qi Zhu, Thomas Hantschel, David Fork, Suresh Sitaraman: J-Springs—Innovative Compliant Interconnects for Next-Generation Packaging, 2002 Electronic Components and Technology Conference, 2002 IEEE, pp. 1359-1365.

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