Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Reexamination Certificate
2007-01-09
2007-01-09
Gilman, Alexander (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
Reexamination Certificate
active
10737272
ABSTRACT:
An electrical interconnect structure that includes a spring portion that extends out of a plane. The electrical interconnect including curved regions to improve the lateral compliance of the interconnect. The curved region may be incorporated into a release region of the spring. The release region may include either or both an uplifted region and a planar region. The curves in the release region are arranged to improve the spring contact with a mating surface and also improve lateral compliance compared to prior art spring designs.
REFERENCES:
patent: 3842189 (1974-10-01), Southgate
patent: 5613861 (1997-03-01), Smith et al.
patent: 5830782 (1998-11-01), Smith et al.
patent: 5859472 (1999-01-01), DiStefano et al.
patent: 5913109 (1999-06-01), Distefano et al.
patent: 5914218 (1999-06-01), Smith et al.
patent: 6184053 (2001-02-01), Eldridge et al.
patent: 6215670 (2001-04-01), Khandros
patent: 6245444 (2001-06-01), Marcus et al.
patent: 6307161 (2001-10-01), Grube et al.
patent: 6361959 (2002-03-01), Beroz et al.
patent: 6439898 (2002-08-01), Chua et al.
patent: 6489248 (2002-12-01), Zhang et al.
patent: 2002/0173146 (2002-11-01), Fork
patent: 2004/0022040 (2004-02-01), Sitaraman et al.
Lunyu Ma, Qi Zhu, Thomas Hantschel, David Fork, Suresh Sitaraman: J-Springs—Innovative Compliant Interconnects for Next-Generation Packaging, 2002 Electronic Components and Technology Conference, 2002 IEEE, pp. 1359-1365.
Chua Christopher L.
Fork David K.
Van Schuylenbergh Koenraad F.
Chen Kent
Gilman Alexander
Palo Alto Research Center Incorporated
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