Wiring connection structure of laminated capacitor and...

Details Wiring connection structure of laminated capacitor and... Wiring connection structure of laminated capacitor and...

2007-05-08

2007-05-08

Dinh, Tuan (Department: 2841)

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

C361S306300, C361S308300, C361S763000

Reexamination Certificate

active

10753004

ABSTRACT:
An apparatus is provided for packaging a laminated capacitor made to have a low ESL value and is used for a decoupling capacitor to be connected to a power supply circuit for a MPU chip providing a MPU. The laminated capacitor is accommodated within a cavity provided on a wiring board. The capacitor includes a plurality of first external terminal electrodes connected to first internal electrodes via a plurality of first feedthrough conductors and a plurality of second external terminal electrodes connected to second internal electrodes via a plurality of second feedthrough conductors. The first external terminal electrodes provided on a first major surface of a capacitor body are connected to via-hole conductors at the hot side for the power source within a substrate, and the second external terminal electrodes provided on first and second major surfaces are connected to grounding via-hole conductors and a mother board within the substrate.

REFERENCES:
patent: 4328530 (1982-05-01), Bajorek et al.
patent: 4349862 (1982-09-01), Bajorek et al.
patent: 4916576 (1990-04-01), Herbert et al.
patent: 5177670 (1993-01-01), Shinohara et al.
patent: 5822174 (1998-10-01), Yamate et al.
patent: 6034864 (2000-03-01), Naito et al.
patent: 6215647 (2001-04-01), Naito et al.
patent: 6327134 (2001-12-01), Kuroda et al.
patent: 6344961 (2002-02-01), Naito et al.
patent: 6351369 (2002-02-01), Kuroda et al.
patent: 6370010 (2002-04-01), Kuroda et al.
patent: 6407906 (2002-06-01), Ahiko et al.
patent: 6407907 (2002-06-01), Ahiko et al.
patent: 6452781 (2002-09-01), Ahiko et al.
patent: 6549395 (2003-04-01), Naito et al.
patent: 60-158612 (1985-08-01), None
patent: 3-36122 (1991-04-01), None
patent: 5-205966 (1993-08-01), None
patent: 7-22728 (1995-01-01), None
patent: 7-142283 (1995-06-01), None
patent: 07-201651 (1995-08-01), None
patent: 07-235632 (1995-09-01), None
patent: 07-297077 (1995-11-01), None
patent: 07-307412 (1995-11-01), None
patent: 7-326536 (1995-12-01), None
patent: 11-204372 (1999-09-01), None
patent: 11-317490 (1999-11-01), None
Official Communication issued in the corresponding Japanese Patent Application No. 2004-376168, dated Aug. 8, 2006.
Official Communication issued in the corresponding German Patent Application No. 10027870.1-34, dated Apr. 28, 2006.

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