Method for measuring a formation parameter while inserting a...

Electricity: measuring and testing – Of geophysical surface or subsurface in situ – Using electrode arrays – circuits – structure – or supports

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

10907515

ABSTRACT:
A system for determining a subsurface parameter from a drilled wellbore includes a casing, a logging tool comprising one or more logging devices, and a latching device coupling the logging tool to the casing such that the logging tool hangs below the casing when the casing is disposed in the wellbore. A method of determining a subsurface parameter includes disposing a casing in a wellbore, coupling the logging tool to the casing such that the logging tool hangs below the casing, and running the casing along the wellbore, wherein the logging tool makes measurements as the casing is run along the wellbore.

REFERENCES:
patent: 4041780 (1977-08-01), Angehrn
patent: 4047430 (1977-09-01), Angehrn
patent: 4349072 (1982-09-01), Escaron et al.
patent: 4457370 (1984-07-01), Wittrisch
patent: 5305830 (1994-04-01), Wittrisch
patent: 5433276 (1995-07-01), Martain et al.
patent: 5543715 (1996-08-01), Singer et al.
patent: 5596142 (1997-01-01), Delpuech et al.
patent: 5809458 (1998-09-01), Tamarchenko
patent: 6119777 (2000-09-01), Runia
patent: 6308561 (2001-10-01), Samworth et al.
patent: 6693554 (2004-02-01), Beique et al.
patent: 6702041 (2004-03-01), Runia
patent: 6705413 (2004-03-01), Tessari
patent: 6747570 (2004-06-01), Beique et al.
patent: 7044241 (2006-05-01), Angman
patent: 2002/0149499 (2002-10-01), Beique et al.
Runia, J. et al., “Through Bore Drilling Systems: a New Drilling Option,” SPE/IADC 79794, SPC/IADC Drilling Conference, Amsterdam, NL (Feb. 19-21, 2003).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for measuring a formation parameter while inserting a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for measuring a formation parameter while inserting a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for measuring a formation parameter while inserting a... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3781713

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.