Method of producing multilayer printed wiring board

Details Method of producing multilayer printed wiring board Method of producing multilayer printed wiring board

2007-04-24

2007-04-24

Aftergut, Jeff H. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S239000, C156S307100, C156S330000, C174S255000, C174S259000, C428S3550EP, C428S901000

Reexamination Certificate

active

10849172

ABSTRACT:
Adhesive films which are useful for preparing laminated circuit boards may be produced by laminating a resin composition layer made of a layer A and layer B on a support base film, in whichlayer A is a layer of a thermosetting resin composition that has an inorganic filler content of from 0 to less than 40% by weight, has a cured surface which after roughening, allows forming a conductor layer by plating, and is solid at ambient temperature,layer B is a layer of a thermosetting resin composition that has an inorganic filler content of 40% by weight or more, and is solid at ambient temperature,layer A is laminated adjacent to the support base film, andlayer B layer has a fluidity that allows the filling of a resin into a through hole and/or a via hole.

REFERENCES:
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patent: 11-296074 (2001-04-01), None
patent: 2001-119150 (2001-04-01), None

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