Method and apparatus for thermo-electric cooling

Details Method and apparatus for thermo-electric cooling Method and apparatus for thermo-electric cooling

2007-05-29

2007-05-29

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S714000, C257S716000, C257S930000, C257SE23082

Reexamination Certificate

active

10688950

ABSTRACT:
Embodiments of the present invention provide a method, apparatus and system for absorbing heat from an active side of a die by a plurality of cold conductive elements embedded in said die, and releasing said absorbed heat by a plurality of hot conductive elements embedded in a substrate connected to said die.

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patent: 6942018 (2005-09-01), Goodson et al.
patent: 6981380 (2006-01-01), Chrysler et al.

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