Land grid array module

Details Land grid array module Land grid array module

2007-04-24

2007-04-24

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE25023, C257S723000, C257S685000, C257S777000, C438S108000, C438S109000, C361S760000

Reexamination Certificate

active

11100151

ABSTRACT:
Disclosed is a land grid array module comprising: a substrate; a plurality of active and passive components mounted on both sides of the substrate; and a molding compound for encapsulating the both sides of the substrate with the active and passive components mounted thereon. The land grid array module mounts the passive and active components on both sides of the substrate, thereby improving the integration of the circuit device. Also, the use of a thin film printed circuit board or a flexible printed circuit board with high rigidity as the substrate reduces the overall thickness of the land grid array module.

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