Metal/ceramic bonding substrate and method for producing same

Details Metal/ceramic bonding substrate and method for producing same Metal/ceramic bonding substrate and method for producing same

2007-03-13

2007-03-13

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S209000, C257S706000, C257S712000, C257S713000, C257S720000, C257S729000, C257S730000

Reexamination Certificate

active

10964426

ABSTRACT:
In a metal/ceramic bonding substrate10wherein a circuit forming metal plate14is bonded to one side of a ceramic substrate12and a radiating metal base plate16is bonded to the other side thereof, a difference in level is provided along the entire circumference of the bonding surface of the ceramic substrate12to the metal base plate16.The difference in level is provided by forming at least one of a rising portion16aand a groove portion116bon and in the metal base plate16.

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patent: 6294244 (2001-09-01), Iwaida et al.
patent: 6309737 (2001-10-01), Hirashima et al.
patent: 2002-76551 (2002-03-01), None

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