Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Reexamination Certificate
2007-01-30
2007-01-30
Lee, Edmund H. (Department: 1732)
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
C264S272170, C264S328400, C425S116000, C425S544000
Reexamination Certificate
active
10648964
ABSTRACT:
According to one embodiment of the invention, a system for packaging integrated circuits includes a mold tool for packaging integrated circuits. The mold tool includes a first mold plate that includes a first non-planar surface and a second mold plate that includes a second non-planar surface. The first and second non-planar surfaces form upper and lower surfaces of a mold cavity when the first and second mold plates are engaged. The mold tool also includes a distribution system coupled to the mold cavity. The distribution system transfers a mold compound into the mold cavity to substantially encapsulate an integrated circuit. The distribution system includes a gate runner coupled to the mold cavity. The gate runner funnels the mold compound into the mold cavity. The distribution system also includes a bridge insert that decreases wear on the gate runner as the mold compound is transferred through the gate runner.
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Brady III Wade James
Lee Edmund H.
Tung Yingsheng
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