Microelectronic assembly having a thermally conductive...

Details Microelectronic assembly having a thermally conductive... Microelectronic assembly having a thermally conductive...

2007-05-29

2007-05-29

Clark, S. V. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S118000

Reexamination Certificate

active

10846722

ABSTRACT:
A thermally conductive member is placed adjacent a microelectronic die with a thermal interface material between the microelectronic die and a wetting layer formed on a surface of the thermally conductive member. The thermal interface material is heated to cause reflow thereof. The first portion of the thermal interface material is directed by the wetting layer into a first cavity formed in the thermally conductive member. The thermal interface material is then allowed to cool and solidify.

REFERENCES:
patent: 6504242 (2003-01-01), Deppisch et al.
patent: 2003/0134454 (2003-07-01), Houle
patent: 2004/0238944 (2004-12-01), Bish et al.
patent: 2005/0068739 (2005-03-01), Arvelo et al.

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