Integrated circuit interconnect fabrication systems

Details Integrated circuit interconnect fabrication systems Integrated circuit interconnect fabrication systems

2007-04-17

2007-04-17

Eley, Timothy V. (Department: 3724)

Abrading

Machine

Combined

C451S288000, C451S339000

Reexamination Certificate

active

10703293

ABSTRACT:
A system for processing a conductive surface on a front surface of a wafer to form a metallic interconnect structure is disclosed. The system for processing comprises an electrochemical mechanical processing (ECMPR) module configured to form a substantially planarized conductive layer on the front surface of the wafer, a chamber within the ECMPR module configured to remove conductive material from an edge region of the wafer, a CMP module configured to receive the wafer from the ECMPR module and polish the planarized conductive layer on the surface of the wafer to form the metallic interconnect structure, and a robot configured to transfer the wafer from the ECMPR module to the chemical mechanical polish (CMP) module. In one aspect of the invention, the ECMPR module deposits conductive material on the front surface of the wafer. The ECMPR module removes at least a portion of the conductive layer from the front surface of the wafer. Advantages of the invention include improved control of deposited metal to improve device consistency and yield.

REFERENCES:
patent: 5679059 (1997-10-01), Nishi et al.
patent: 5826129 (1998-10-01), Hasebe et al.
patent: 5827110 (1998-10-01), Yajima et al.
patent: 5830045 (1998-11-01), Togawa et al.
patent: 5885138 (1999-03-01), Okumura et al.
patent: 5954072 (1999-09-01), Matusita
patent: 5972110 (1999-10-01), Akimoto
patent: 6004880 (1999-12-01), Liu et al.
patent: 6110011 (2000-08-01), Somekh et al.
patent: 6132289 (2000-10-01), Labunsky et al.
patent: 6136163 (2000-10-01), Cheung et al.
patent: 6402925 (2002-06-01), Talieh
patent: 6409576 (2002-06-01), Oguri et al.
patent: 6468022 (2002-10-01), Whitcomb
patent: 6494985 (2002-12-01), Sotozaki et al.
patent: 6578853 (2003-06-01), Treur et al.
patent: 6613200 (2003-09-01), Li et al.
patent: 6656842 (2003-12-01), Li et al.
patent: 6709970 (2004-03-01), Park et al.
patent: 6857838 (2005-02-01), Kuroda
patent: 6979625 (2005-12-01), Woo et al.
patent: 0978867 (2000-02-01), None
patent: 1037263 (2000-09-01), None

Affiliated with

Also associated with

Rating

Integrated circuit interconnect fabrication systems does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit interconnect fabrication systems, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit interconnect fabrication systems will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3778852