Composite tantalum nitride/tantalum copper capping layer

Details Composite tantalum nitride/tantalum copper capping layer Composite tantalum nitride/tantalum copper capping layer

2007-01-02

2007-01-02

Lee, Eugene (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257SE23160, C438S627000, C438S643000, C438S653000, C438S927000

Reexamination Certificate

active

10934511

ABSTRACT:
Electromigration and stress migration of Cu interconnects are significantly reduced by forming a composite capping layer comprising a layer of tantalum nitride on the upper surface of the inlaid Cu and a layer of α-Ta on the titanium nitride layer. Embodiments include forming a recess in an upper surface of an upper surface of Cu inlaid in a dielectric layer, depositing a layer of titanium nitride of a thickness of 20 Å to 100 Å and then depositing a layer of α-Ta at a thickness of 200 Å to 500 Å.

REFERENCES:
patent: 6157081 (2000-12-01), Nariman et al.
patent: 6229211 (2001-05-01), Kawanoue et al.
patent: 6339258 (2002-01-01), Cooney et al.
patent: 6437440 (2002-08-01), Cabral et al.
patent: 6475909 (2002-11-01), Uozumi
patent: 6555461 (2003-04-01), Woo et al.
patent: 6706625 (2004-03-01), Sudijono et al.
patent: 6723635 (2004-04-01), Ngo et al.
patent: 2002/0006468 (2002-01-01), Paranjpe et al.
patent: 2003/0001271 (2003-01-01), Uozumi
patent: 2003/0089597 (2003-05-01), Tang et al.
patent: 2004/0131878 (2004-07-01), Seet et al.
patent: 2004/0248403 (2004-12-01), Dubin et al.
patent: 2005/0001325 (2005-01-01), Andricacos et al.
patent: 2005/0118796 (2005-06-01), Chiras et al.

Affiliated with

Also associated with

Rating

Composite tantalum nitride/tantalum copper capping layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composite tantalum nitride/tantalum copper capping layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composite tantalum nitride/tantalum copper capping layer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3778596