Method for testing semiconductor components using bonded...

Details Method for testing semiconductor components using bonded... Method for testing semiconductor components using bonded...

2007-09-18

2007-09-18

Nguyen, Ha Tran (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

11698678

ABSTRACT:
A method for testing a semiconductor component includes the steps of bonding an interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the component. The bonding step can be performed using metallurgical bonding, and the separating step can be performed using solder-wettable and solder non-wettable metal layers on the interconnect or the component. During the separating step the solder-wettable layers are dissolved, reducing adhesion of the bonded electrical connections, and permitting separation of the component and interconnect. The interconnect includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. A system includes the interconnect, an alignment system for aligning the substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconnect for separation.

REFERENCES:
patent: 4899921 (1990-02-01), Bendat et al.
patent: 4931726 (1990-06-01), Kasukabe et al.
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5389873 (1995-02-01), Ishii et al.
patent: 5434513 (1995-07-01), Fuji et al.
patent: 5440239 (1995-08-01), Zappella et al.
patent: 5497079 (1996-03-01), Yamada et al.
patent: 5519332 (1996-05-01), Wood et al.
patent: 5532610 (1996-07-01), Tsujide et al.
patent: 5539324 (1996-07-01), Wood et al.
patent: 5570032 (1996-10-01), Atkins et al.
patent: 5796264 (1998-08-01), Farnworth et al.
patent: 5962921 (1999-10-01), Farnworth et al.
patent: 6107109 (2000-08-01), Akram et al.
patent: 6111321 (2000-08-01), Agarwala
patent: 6119255 (2000-09-01), Akram
patent: 6166556 (2000-12-01), Wang et al.
patent: 6202298 (2001-03-01), Smith
patent: 6233185 (2001-05-01), Beffa et al.
patent: 6285203 (2001-09-01), Akram et al.
patent: 6297658 (2001-10-01), Nakata et al.
patent: 6351134 (2002-02-01), Leas et al.
patent: 6379982 (2002-04-01), Ahn et al.
patent: 6384613 (2002-05-01), Cheng et al.
patent: 6400169 (2002-06-01), Hembree
patent: 6400174 (2002-06-01), Akram et al.
patent: 6409073 (2002-06-01), Kaskoun et al.
patent: 6426904 (2002-07-01), Barth et al.
patent: 6469530 (2002-10-01), Johnson et al.
patent: 6552560 (2003-04-01), Melgaard et al.
patent: 6557244 (2003-05-01), Yang
patent: 6580283 (2003-06-01), Carbone et al.
patent: 6627917 (2003-09-01), Fenner et al.
patent: 6640323 (2003-10-01), Akram
patent: 6677172 (2004-01-01), Hou et al.
patent: 6737882 (2004-05-01), Wood et al.
patent: 6753547 (2004-06-01), Devereaux
patent: 6767411 (2004-07-01), Yeh et al.
patent: 6767819 (2004-07-01), Lutz
patent: 6784678 (2004-08-01), Pietzschmann
patent: 6788085 (2004-09-01), Notohardjono et al.
patent: 6788094 (2004-09-01), Khandros et al.
patent: 6790684 (2004-09-01), Ahn et al.
patent: 6893885 (2005-05-01), Lemmerhirt et al.
patent: 7009294 (2006-03-01), Hikita et al.
patent: 2002/0196047 (2002-12-01), Doherty et al.
patent: 2005/0253614 (2005-11-01), Maruyama et al.
patent: 2006/0014309 (2006-01-01), Sachdev et al.

Affiliated with

Also associated with

Rating

Method for testing semiconductor components using bonded... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for testing semiconductor components using bonded..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for testing semiconductor components using bonded... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3777899