Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2007-05-01
2007-05-01
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S296000
Reexamination Certificate
active
11103939
ABSTRACT:
According to some embodiments, a device includes a first conductive plane electrically coupled to a first terminal associated with a first polarity and a second terminal associated with the first polarity, a second conductive plane electrically coupled to a third terminal associated with a second polarity, a dielectric disposed between the first conductive plane and the second conductive plane, a third conductive plane electrically coupled to the second terminal and not electrically coupled to the first terminal, and a second dielectric disposed between the second conductive plane and the third conductive plane. A first capacitance is present between the first terminal and the third terminal, a second capacitance is present between the second terminal and the third terminal, and the first capacitance and the second capacitance may be substantially dissimilar.
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“European Search Report of the European Patent Office”, mailed Jul. 26, 2006, for EP 04754645.2, 4pgs.
Desmith Michael M.
Figueroa David G.
Hester Jennifer A.
Li Yuan-Liang
Zhong Dong
Buckley Maschoff & Talwalkar LLC
Trinh Hoa (Vikki) B.
Weiss Howard
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