Multilayer inductor with shielding plane

Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil

Reexamination Certificate

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C336S223000, C029S602100

Reexamination Certificate

active

10736336

ABSTRACT:
Some embodiments provide a first portion of an inductor disposed in a first layer of a multilayer substrate, a second portion of the inductor disposed in a second layer of the multilayer substrate, the second portion coupled to the first portion, and a shielding plane disposed between the first portion and the second portion.

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Yue et al., “On Chip Spiral Inductors with Patterned Ground Shields for Si-Based RF IC's”, May 1998, IEEE Journal of Solid State Circuits, vol. 33, No. 5. pp. 743-752.
Davis, M.F. et al.: “RF-Microwave Multi-band Design Solutions for Multilayer Organic System on Package Integrated Passives”, NSF Packaging Research Center, Yamacraw Design Center, School of ECE, Georgia Institute of Technology, Atlanta, GA 30312. 4pgs.
Davis, Mekita F. et al.: “Integrated RF Architectures in Fully-Organic SOP Technology”, IEEE Transactions on Advanced Packaging, vol. 25, No. 2, May 2002, ISSN: 1521-3323. pp. 136-142.
Bushyager, Nathan et al.: “Q-Factor Prediction and Optimization of Multilayer Inductors for RF Packaging Microsystems Using Time Domain Techniques”, The Georgia Institute of Technology, 4pgs.
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