Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Reexamination Certificate
2007-03-13
2007-03-13
Egwim, Kelechi C. (Department: 1713)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
C525S374000, C525S375000, C525S410000, C525S417000, C524S082000, C524S086000, C524S107000
Reexamination Certificate
active
10305258
ABSTRACT:
A resist pattern thickening material has resin, a crosslinking agent and a compound having a cyclic structure, or resin having a cyclic structure at a part. A resist pattern has a surface layer on a resist pattern to be thickened with etching rate (nm/s) ratio of the resist pattern to be thickened the surface layer of 1.1 or more, under the same condition, or a surface layer to a resist pattern to be thickened. A process for forming a resist pattern includes applying the thickening material after forming a resist pattern to be thickened on its surface. A semiconductor device has a pattern formed by the resist pattern. A process for manufacturing the semiconductor device has applying, after forming a resist pattern to be thickened, the thickening material to the surface of the resist pattern to be thickened, and patterning the underlying layer by etching, the pattern as a mask.
REFERENCES:
patent: 5147344 (1992-09-01), Sachau et al.
patent: 5858620 (1999-01-01), Ishibashi et al.
patent: 6146806 (2000-11-01), Maeda et al.
patent: 6319853 (2001-11-01), Ishibashi et al.
patent: 6455228 (2002-09-01), Tachikawa et al.
patent: 6579657 (2003-06-01), Ishibashi et al.
patent: 2002/0016431 (2002-02-01), Iwasa et al.
patent: 2002/0037476 (2002-03-01), Kamijima
patent: 2002/0146645 (2002-10-01), Tachikawa et al.
patent: 198 14 142 (1998-10-01), None
patent: 198 43 179 (1999-07-01), None
patent: 199 15 899 (2000-02-01), None
patent: 100 14 083 (2001-03-01), None
patent: 1 152 036 (2001-11-01), None
patent: 1 223 470 (2002-07-01), None
patent: 5-197151 (1993-08-01), None
patent: 05197151 (1993-08-01), None
patent: 10-73927 (1998-03-01), None
patent: 11-149160 (1999-06-01), None
patent: 2000-347414 (2000-12-01), None
patent: 2001-228616 (2001-08-01), None
patent: 2001228616 (2001-08-01), None
patent: 2001-242636 (2001-09-01), None
patent: 2002-49161 (2002-02-01), None
patent: 2002-6491 (2002-09-01), None
Database WPI; Section Ch, Week 198709; Derwent Publications Ltd., London, GB; AN 1987-059912; XP002222917 & JP 62 013390 A (Kanzaki Paper Mfg Co Ltd), Jan. 22, 1987;*abstract*.
Database WPI; Section Ch, Week 198423; Derwent Publications Ltd., London, GB; AN 1984-142833; XP002222915 & JP 59 073944 A (Bridgestone Tire KK), Apr. 26, 1984;*abstract*.
Database WPI; Section Ch, Week 199438; Derwent Publication Ltd., London, GB; AN 1994-307445; XP002222934 & JP 06 234275 A (Oji Paper Co), Aug. 23, 1994;*abstract*.
Kon Junichi
Kozawa Miwa
Namiki Takahisa
Nozaki Koji
Yano Ei
Egwim Kelechi C.
Fujitsu Limited
Westerman, Hattori, Daniels & Adrian , LLP.
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