Semiconductor component assemblies having interconnects

Details Semiconductor component assemblies having interconnects Semiconductor component assemblies having interconnects

2007-04-24

2007-04-24

Fourson, George (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S738000, C257S777000, C257S784000, C257SE21588, C257SE21499, C257SE21515, C257SE21573

Reexamination Certificate

active

11123466

ABSTRACT:
Methods relating to forming interconnects through injection of conductive materials, to fabricating semiconductor component assemblies, and to resulting assemblies. A semiconductor component substrate, such as a semiconductor die or other substrate, has dielectric material disposed on a surface thereof, surrounding but not covering interconnect elements, such as bond pads, on that surface. A second semiconductor component substrate, such as a carrier substrate with interconnect elements such as terminal pads, is adhered to the first semiconductor component substrate, forming a semiconductor package assembly having interconnect voids between the corresponding interconnect elements. A flowable conductive material is then injected into each interconnect void using an injection needle that passes through one of the substrates into the interconnect void, forming a conductive interconnect between the bond pads and terminal pads of the substrates. In another embodiment, a conductive material is preplaced into the interconnect voids and ultrasonically heated to a flowable state.

REFERENCES:
patent: 4818728 (1989-04-01), Rai et al.
patent: 5739585 (1998-04-01), Akram et al.
patent: 6163463 (2000-12-01), Marrs
patent: 6229158 (2001-05-01), Minemier et al.
patent: 6276596 (2001-08-01), Gruber et al.
patent: 6341418 (2002-01-01), Brouillette et al.
patent: 6386422 (2002-05-01), Cheng et al.
patent: 6426241 (2002-07-01), Cordes et al.
patent: 6452117 (2002-09-01), Curcio et al.
patent: 6459150 (2002-10-01), Wu et al.
patent: 6461136 (2002-10-01), Gruber et al.
patent: WO 95/05675 (1995-02-01), None
patent: WO 95/05676 (1995-02-01), None

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