Compositions – Electrically conductive or emissive compositions
Reexamination Certificate
2007-03-27
2007-03-27
Kopec, Mark (Department: 1751)
Compositions
Electrically conductive or emissive compositions
C252S071000, C252S072000, C252S511000, C252S514000, C252S516000, C252S518100, C528S018000, C528S020000, C528S022000, C528S025000, C525S105000, C525S106000, C525S100000, C524S265000, C524S405000, C524S426000, C524S506000, C264S478000, C264S464000, C257S712000, C156S325000, C156S336000
Reexamination Certificate
active
10361567
ABSTRACT:
The invention provides a curable composition for a heat conductive material, having an excellent durability, a satisfactory heat conductive property and a high productivity with easily controllable surface tackiness, a heat conductive material obtained from such curable composition and a method for controlling the surface tackiness of the composition after curing. The curable composition for the heat conductive material is formed by a curable composition of heat curable type based on crosslinking by a hydrosilylation reaction and including a saturated hydrocarbon polymer containing at least an alkenyl group in a molecule, a curing agent containing at least two hydrosilyl groups in a molecule and a hydrosilylation catalyst, to which a heat conductive filler is incorporated, thereby providing a flexible elastomer with a satisfactory heat conductivity and with an easily controllable surface tackiness.
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Kaneka Corporation
Kenyon & Kenyon LLP
Kopec Mark
Vijayakumar Kallambella
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