Semiconductor devices and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor

Reexamination Certificate

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Details

C257S097000, C257S103000, C257S310000

Reexamination Certificate

active

10868774

ABSTRACT:
In a field effect transistor, an Si layer11, an SiC (Si1−yCy) channel layer12, a CN gate insulating film13made of a carbon nitride layer (CN) and a gate electrode14are deposited in this order on an Si substrate10. The thickness of the SiC channel layer12is set to a value that is less than or equal to the critical thickness so that a dislocation due to a strain does not occur according to the carbon content. A source region15and a drain region16are formed on opposite sides of the SiC channel layer12, and a source electrode17and a drain electrode18are provided on the source region15and the drain region16, respectively.

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M. Togo et al., “Low-Leakage and Highly-Reliable 1.5 nm SiOn Gate-Dielectric Using Radical Oxynitridation for Sub-0.1 μm CMOS”, 2000 Symposium on VLSI Technology Digest of Tchnical Papers.

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