Abrading – Abrading process – Utilizing fluent abradant
Reexamination Certificate
2007-09-18
2007-09-18
Eley, Timothy V. (Department: 3724)
Abrading
Abrading process
Utilizing fluent abradant
C451S041000, C451S059000, C451S063000, C451S330000
Reexamination Certificate
active
11134586
ABSTRACT:
A chemical mechanical polishing process includes rotating at least one of a semiconductor substrate and polishing pad relative to the other. A chemical mechanical polishing slurry is provided intermediate the substrate and pad. The substrate is polished with the slurry and pad during the rotating. The chemical mechanical polishing slurry includes liquid and abrasive solid components. At least some of the abrasive solid component includes individually non-homogeneous abrasive particles.
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Eley Timothy V.
Micro)n Technology, Inc.
Wells St. John P.S.
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