Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-09-11
2007-09-11
Kim, Paul D. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S417000, C029S603110, C029S603130, C029S603160, C029S603180, C216S065000, C427S127000, C427S128000, C451S005000, C451S041000
Reexamination Certificate
active
10672880
ABSTRACT:
A method for fabricating a multi-track thin-film magnetoresistive tape head with precisely-aligned read/write track-pairs fabricated on a monolithic substrate wafer is provided. The wafer is fabricated using modified standard thin-film processes for fabricating direct access storage device heads and modified substrate lapping procedures. Gap-to-gap separation within each read/write track-pair is reduced to nearly the thickness of the substrate wafer. Fabricating on both sides of the wafer, may enable hundreds or thousands of head elements to be aligned in one step of the fabrication process while reducing the number of pieces in the completed head assembly.
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Biskeborn Robert Glenn
Eaton James Howard
Aiello Jeffrey P.
Gill William D.
International Business Machines - Corporation
Kim Paul D.
LandOfFree
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