Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1979-05-23
1982-03-30
Husar, Francis S.
Metal working
Method of mechanical manufacture
Assembling or joining
29580, 29423, 156636, 250211J, 350162SF, 350166, 357 24, 357 31, H01L 3104
Patent
active
043217478
ABSTRACT:
A solid-state image sensing device having an enhanced sensitivity to a short wavelength comprises an optical substrate for passing a predetermined light therethrough, a semiconductor substrate supported on the optical substrate and a plurality of electrodes formed on an insulating layer overlying the semiconductor substrate, in which a light corresponding to an object is incident from the optical substrate side.
REFERENCES:
patent: 2904613 (1959-09-01), Paradise
patent: 3428499 (1969-02-01), Cullis
patent: 3462322 (1969-08-01), Hennings et al.
patent: 3466120 (1969-09-01), Herriott et al.
patent: 3612698 (1971-10-01), Mathisen
patent: 3768888 (1973-10-01), Nishino et al.
patent: 3978512 (1976-08-01), Hoeberechts
patent: 3979239 (1976-09-01), Walsh
patent: 3986069 (1976-10-01), Funahashi
patent: 3996461 (1976-12-01), Sulzbach et al.
patent: 4029394 (1977-06-01), Araki
patent: 4040092 (1977-08-01), Carnes
patent: 4139444 (1979-02-01), Singer et al.
patent: 4196009 (1980-04-01), Martin et al.
patent: 4276114 (1981-06-01), Takano et al.
Shortes et al., Appl. Phys. Letters, 24, No. 11, Jun. 1, 1974, pp. 565-567.
Gray et al., (Intr. Conf. Tech. & Appl. of Charged Coupled Devices, Univ. of Edinburgh, Sep. 25-27, 1974) pp. 162/167.
Ancliffe et al., Trans. on Elec. Devices, vol. ED-23, No. 11, Nov. 1976, pp. 1225-1232.
Blouke et al., (Intr. Solid-State Circuits Conf., Feb. 15, 1978) pp. 36-37.
Proceedings of 1978 Intrnat. Microelectronics Symposium, Sep. 25-27, 1978, pp. 340-343, Publ. by Internat. Soc. for Hybrid Microelectronics, (Paper authored by S. Goldfarb and D. Calvin).
IBM Tech. Discl. Bull., vol. 12, No. 12, May 1970, p. 2065.
Takemura Yasuo
Yoshida Okio
Arbes C. J.
Husar Francis S.
Tokyo Shibaura Denki Kabushiki Kaisha
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