Method of manufacturing a solid-state image sensing device

Metal working – Method of mechanical manufacture – Assembling or joining

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29580, 29423, 156636, 250211J, 350162SF, 350166, 357 24, 357 31, H01L 3104

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active

043217478

ABSTRACT:
A solid-state image sensing device having an enhanced sensitivity to a short wavelength comprises an optical substrate for passing a predetermined light therethrough, a semiconductor substrate supported on the optical substrate and a plurality of electrodes formed on an insulating layer overlying the semiconductor substrate, in which a light corresponding to an object is incident from the optical substrate side.

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