Manufacturing method of acoustic sensor

Details Manufacturing method of acoustic sensor Manufacturing method of acoustic sensor

2007-04-17

2007-04-17

Kim, Paul D (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S417000, C029S592100, C029S609100, C181S171000, C181S172000, C216S065000, C156S089110, C156S089120, C381S173000, C381S175000, C381S396000, C381S398000, C367S170000, C367S171000, C367S181000, C367S140000, C367S141000

Reexamination Certificate

active

11185775

ABSTRACT:
The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor100and a case200for accommodating the acoustic sensor100, the acoustic sensor100has a semiconductor chip110forming necessary electronic circuits111A to111C, and opening a through hole112away from the electronic circuits111A to111C, an electrode layer120formed on the surface of the semiconductor chip110away from the through hole112, an electret member130laminated away from part of the electrode layer120and through hole112, and a diaphragm140provided with a spacing160to the electret member130, in which the electrode layer120exposed from the electret member130is connected to the electrode111aof the electronic circuit111A through the case200(FIG.6).

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“Assessment of measuring conditions with the pulse electro-acoustic system adapted to work under electronic irradiation”; Griserl, V.; Fukunaga, K.; Maeno, T.: Laurent, C.; Payan, D.; Levy, L.; Electrical Insulation and Dielectric Phenomena, Oct. 19-22, 2003.

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