Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2007-04-03
2007-04-03
Lindsay, Jr., Walter (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
C257SE21521
Reexamination Certificate
active
10770681
ABSTRACT:
A method for identifying faults in a semiconductor fabrication process includes storing measurements for a plurality of parameters of a wafer in the semiconductor fabrication process. A first subset of the parameters is selected. The subset is associated with a feature formed on the wafer. A principal component analysis model is applied to the first subset to generate a performance metric. A fault condition with the wafer is identified based on the performance metric. A system includes a data store and a fault monitor. The data store is adapted to store measurements for a plurality of parameters of a wafer in a semiconductor fabrication process. The fault monitor is adapted to select a first subset of the parameters, the subset being associated with a feature formed on the wafer, apply a principal component analysis model to the first subset to generate a performance metric, and identify a fault condition with the wafer based on the performance metric.
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Cherry Gregory A.
Kadosh Daniel
Advanced Micro Devices , Inc.
Lindsay, Jr. Walter
Stevenson Andre′
Williams Morgan & Amerson P.C.
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