Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2007-01-09
2007-01-09
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257SE27111
Reexamination Certificate
active
10800603
ABSTRACT:
A semiconductor device substrate includes a substrate body having a wiring layer. A base is formed by a material that is different from a material of the substrate body. The base supports the substrate body, and has an opening forming portion where a semiconductor element is mounted. A reinforcing member is larger than the opening forming portion, provided in the substrate body at a portion corresponding to the opening forming portion, and reinforces the substrate body at the portion corresponding to the opening forming portion.
REFERENCES:
patent: 6407929 (2002-06-01), Hale et al.
patent: 6737742 (2004-05-01), Sweterlitsch
patent: 2002/0100611 (2002-08-01), Crockett et al.
patent: 2001-274034 (2001-10-01), None
Ooi Kiyoshi
Rokugawa Akio
Takano Akihito
Yamasaki Tomoo
Ladas & Parry LLP
Sandvik Benjamin P.
Shinko Electric Industries Co. Ltd.
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