Electronic component mounting board, electronic component...

Details Electronic component mounting board, electronic component... Electronic component mounting board, electronic component...

2007-09-25

2007-09-25

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S719000, C257S712000

Reexamination Certificate

active

10457247

ABSTRACT:
A ceramic laminated board is provided which has thermal via holes penetrating the inside from the main face of the board. In the thermal via hole, a heat transfer body is placed which has a metallic body and a composite material provided entirely or partially between the metallic body and the ceramic laminated board. The composite material is higher in thermal conductivity than air and is lower in thermal expansion coefficient than the metallic body.

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European Search Report for EP 03 01 2908, dated Aug. 28, 2006.

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