Printed circuit board made by dispersion imaging

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428199, 428220, 428216, 427 96, 427 98, 427 43, 427 53, 427 56, 96 384, 174 685, H01K 318

Patent

active

041210077

ABSTRACT:
A novel printed circuit board with a circuit of high precision having a polymer coat layer between a base and a dispersion imaging material layer and a pattern circuit on undispersed portions of the dispersion imaging material layer. Such a printed circuit board is prepared by a simplified process which comprises essentially two steps, namely, exposure of the dispersion imaging material through a circuit pattern mask to obtain a pattern circuit of the unexposed portions and conductive metal plating wherein said unexposed portions are selectively deposited with the conductive metal due to the specific effect of provision of the polymer coat layer directly under the dispersion imaging material layer.

REFERENCES:
patent: 4000334 (1976-12-01), Hallman et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Printed circuit board made by dispersion imaging does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit board made by dispersion imaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board made by dispersion imaging will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-376267

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.