Single package design for 3-axis magnetic sensor

Details Single package design for 3-axis magnetic sensor Single package design for 3-axis magnetic sensor

2007-09-18

2007-09-18

Lefkowitz, Edward (Department: 2862)

Electricity: measuring and testing

Magnetic

Magnetometers

Reexamination Certificate

active

11022495

ABSTRACT:
A sensor package comprising an X-axis sensor circuit component, a Y-axis sensor circuit component, and a Z-axis sensor circuit component, each mounted to a top surface of a rigid substrate. To minimize the height of the package, a channel is cut out of the top surface of the substrate in order to accommodate the Z-axis sensor component. On the Z-axis sensor component, input/output (I/O) pads are all arranged in an array along one edge of the sensor to conductively cooperate with I/O pads, or solder-filled vias, on the substrate located at a top edge of the channel. Once the sensors have all been mounted to the substrate, the package is encapsulated, and the overall height is less than 1.2 mm.

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