Heat-dissipating module and structure thereof

Details Heat-dissipating module and structure thereof Heat-dissipating module and structure thereof

2007-07-17

2007-07-17

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S185000, C165S122000, C257S722000, C361S703000

Reexamination Certificate

active

11009419

ABSTRACT:
A heat-dissipating structure. The heat-dissipating structure comprises a plurality of first and second conductive plates. Each first conductive plate has a first base surface, a first reference surface and a first main disturbing portion disposed on the first base surface and the first reference surface, and each second conductive plate has a second base surface, a second reference surface and a first sub disturbing portion disposed on the second base surface and the second reference surface. A middle passage, formed between two adjacent first and second conductive plates by facing the second base surface of the second conductive plate to the first reference surface of the first conductive plate, provides airflow passing therethrough with uniform flow resistance.

REFERENCES:
patent: 5558155 (1996-09-01), Ito
patent: 6324061 (2001-11-01), Kinoshita et al.
patent: 6590770 (2003-07-01), Rogers et al.
patent: 2585412 (2003-11-01), None
patent: 2603514 (2004-02-01), None
patent: 332723 (1986-10-01), None
patent: 425053 (1987-10-01), None
patent: 545621 (1990-11-01), None

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